Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/22/2009
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Application #:
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11520905
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Filing Dt:
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09/14/2006
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Publication #:
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Pub Dt:
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03/20/2008
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Inventors:
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Boris Kolodin, Michael Hsing, Srinath K. Aanegola, Stanton Earl Weaver JR. et al
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Title:
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SUPPORT WITH RECESSED ELECTRICALLY CONDUCTIVE CHIP ATTACHMENT MATERIAL FOR FLIP-CHIP BONDING A LIGHT EMITTING CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6180 HALLE DRIVE |
| VALLEY VIEW, OHIO 44125 |
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| FAY, SHARPE, FAGAN, MINNICH & MCKEE, LLP |
| 1100 SUPERIOR AVENUE, SEVENTH FLOOR |
| CLEVELAND, OH 44114 |
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