Patent Assignment Abstract of Title
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Total Assignments:
6
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Patent #:
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Issue Dt:
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01/26/2010
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Application #:
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11496111
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Filing Dt:
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07/31/2006
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Publication #:
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Pub Dt:
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01/31/2008
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Inventors:
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Chi Wah Kok, Yee Ching Tam
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Title:
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SUBSTRATE AND PROCESS FOR SEMICONDUCTOR FLIP CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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72 TAT CHEE AVE. |
UNIT 133, 1/F, TECH CENTER |
KOWLOON TONG, KOWLOON, HONG KONG |
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MERCHANT & GOULD PC |
P.O. BOX 2903 |
MINNEAPOLIS, MN 55402-0903 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TONG WU |
MERCHANT & GOULD P.C. |
P.O. BOX 2903 |
MINNEAPOLIS, MN 55402 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3/F, ANNEX BUILDING, THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY |
CLEAR WATER BAY |
KOWLOON, HONG KONG |
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TONG WU |
P.O. BOX 2910 |
MERCHANT & GOULD P.C. |
MINNEAPOLIS, MN 55402 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7251 W LAKE MEAD BLVD, STE 300 |
LAS VEGAS, NEVADA 89128 |
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SHARON LIN |
RM.1402,14TH FL., NO. 205, DUNHUA N. RD. |
TAIPEI CITY, 105 TAIWAN |
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Assignment:
5
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RE-RECORD TO CORRECT THE NAME OF THE ASSIGNOR, PREVIOUSLY RECORDED ON REEL 020458 FRAME 0022.
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7251 W LAKE MEAD BLVD, STE 300 |
LAS VEGAS, NEVADA 89128 |
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SCHWABE WILLIAMSON & WYATT |
1420 5TH, SUITE 3010 |
SEATTLE, WASHINGTON 98101 |
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Assignment:
6
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7251 W LAKE MEAD BLVD, STE 300 |
LAS VEGAS, NEVADA 89128 |
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SCHWABE WILLIAMSON & WYATT |
1420 5TH, SUITE 3010 |
SEATTLE, WA 98101 |
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