Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/16/2010
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Application #:
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11559157
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Filing Dt:
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11/13/2006
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Publication #:
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Pub Dt:
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05/15/2008
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Inventors:
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Guoqing Yu, Youjun Wang, Qinqin Xu, Qingwei Wang, Wei Wang
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Title:
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WAFER LEVEL CHIP SIZE PACKAGED CHIP DEVICE WITH A DOUBLE-LAYER LEAD STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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428 XINGLONG STREET |
11B/C, SUCHUN INDUSTRIAL SQUARE |
SUZHOU INDUSTRIAL PARK, CHINA 215126 |
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CHARLES E. WANDS |
1901 S. HARBOR CITY BLVD. |
STE. 507 |
MELBOURNE, FL 32901 |
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