Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/16/2010
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Application #:
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11882551
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Filing Dt:
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08/02/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Inventors:
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Yu-Ren Chen, Geng-Shin Shen, Hung-Tsun Lin
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Title:
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STACKED CHIP PACKAGING WITH HEAT SINK STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM 12, BERMUDA |
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| STANLEY P. FISHER |
| REED SMITH LLP |
| 3110 FAIRVIEW PARK DR. |
| SUITE 1400 |
| FALLS CHURCH, VA 22042 |
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