Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
03/23/2010
|
Application #:
|
11483861
|
Filing Dt:
|
07/10/2006
|
Publication #:
|
|
Pub Dt:
|
01/17/2008
| | | | |
Inventors:
|
Tan Xiaochun, Li Yunfang
|
Title:
|
CHIP SCALE PACKAGE (CSP) ASSEMBLY APPARATUS AND METHOD
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
PLANT NO. 1, LANE 18, SAN ZHUANG ROAD |
SONGJIANG EXPORT ZONE, SHANGHAI, CHINA |
|
|
|
CHAD R. WALSH FOUNTAINHEAD LAW GROUP |
SUITE 509 |
900 LAFAYETTE ST. |
SANTA CLARA, CA 95050 |
|
|
Search Results as of:
06/21/2024 08:56 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|