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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/20/2010
Application #:
11906481
Filing Dt:
10/02/2007
Publication #:
Pub Dt:
04/24/2008
Inventors:
Byoung-young Kang, San-deok Hwang
Title:
CHIP PACKAGE FOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
020078/0857Recorded: 11/06/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/01/2007
Exec Dt:
10/01/2007
Assignee:
28 SUNGJU-DONG
CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Correspondent:
BRIAN C. RUPP
DRINKER BIDDLE & REATH LLP
191 N. WACKER DRIVE, SUITE 3700
CHICAGO, ILLINOIS 60606-1698

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