Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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04/20/2010
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Application #:
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11743829
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
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11/08/2007
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Inventors:
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Keun-hyuk Lee, O-seob Jeon, Seung-won Lim
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Title:
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POWER MODULE FOR LOW THERMAL RESISTANCE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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(420-711) 82-3 DODANG-DONG WOMNI-GU |
BUCHEON-SI, KOREA, REPUBLIC OF |
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THOMAS R. FITZGERALD, ESQ. |
HISCOCK & BARCLAY, LLP |
2000 HSBC PLAZA, 100 CHESTNUT ST. |
ROCHESTER, NY 14604-2404 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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60 WALL STREET |
NEW YORK, NEW YORK 10005 |
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DANIEL GOLD/WHITE & CASE LLP |
1221 AVENUE OF THE AMERICAS |
NEW YORK, NY 10020 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, ARIZONA 85008 |
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, AZ 85008 |
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Assignment:
4
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RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 04481, FRAME 0541
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5005 EAST MCDOWELL ROAD, MAILDROP A700 |
PHOENIX, ARIZONA 85008 |
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5005 EAST MCDOWELL ROAD, MAILDROP A700 |
PHOENIX, ARIZONA 85008 |
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JUSTINE LU/WHITE & CASE LLP |
555 SOUTH FLOWER STREET, SUITE 2700 |
LOS ANGELES, CA 90071 |
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