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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/04/2010
Application #:
11850218
Filing Dt:
09/05/2007
Publication #:
Pub Dt:
03/05/2009
Inventors:
Tim Boescke, Johannes Heitmann, Uwe Schroder
Title:
INTEGRATED CIRCUIT WITH DIELECTRIC LAYER
Assignment: 1
Reel/Frame:
020090/0410Recorded: 11/09/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/17/2007
Exec Dt:
09/06/2007
Exec Dt:
09/06/2007
Assignee:
GUSTAV-HEINEMANN-RING 212
MUENCHEN, GERMANY 81739
Correspondent:
STEVEN E. DICKE
100 SOUTH 5TH STREET
SUITE 2250
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
029018/0043Recorded: 09/20/2012Pages: 20
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/15/2009
Assignee:
NOETHNITZER STR. 64
DRESDEN, GERMANY 01187
Correspondent:
PATRICK J. FINNAN
1901 RESEARCH BOULEVARD
SUITE 400
ROCKVILLE, MD 20850

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