Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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10888224
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Filing Dt:
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07/09/2004
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Inventors:
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Jeffrey M. Peterson, Eric F. Schulte
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Title:
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WAFER BONDED COMPOSITE STRUCTURE FOR THERMALLY MATCHING A READOUT CIRCUIT (ROIC) AND AN INFRARED DETECTOR CHIP BOTH DURING AND AFTER HYBRIDIZATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 870 WINTER STREET |
| OFFICE OF THE GENERAL COUNSEL |
| WALTHAM, MASSACHUSETTS 02451-1449 |
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| RAYTHEON COMPANY, WILLIAM C. SCHUBERT |
| INTELLECTUAL PROPERTY & LICENSING |
| 2000 EAST EL SEGUNDO BOULEVARD |
| P.O. BOX 902; EO/E04/N119 |
| EL SEGUNDO, CA 90245-0902 |
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