Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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10594322
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Filing Dt:
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01/17/2007
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Publication #:
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Pub Dt:
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09/20/2007
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Inventor:
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Daisuke Hirokane
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Title:
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EPOXY RESIN COMPOSITION FOR THE ENCAPSULATION OF SEMICONDUCTORS AND SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHISHINAGAWA 2-CHOME, SHINAGAWA-KU, |
| TOKYO, JAPAN 140-0002 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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