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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
05/25/2010
Application #:
12287560
Filing Dt:
10/10/2008
Publication #:
Pub Dt:
04/15/2010
Inventors:
Lee R. Hinze, G. Venkata Krishnan, Scott E. Wilson
Title:
ELECTRONIC MODULE WITH HEAT SINK
Assignment: 1
Reel/Frame:
024488/0090Recorded: 06/04/2010Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/16/2008
Exec Dt:
09/24/2008
Exec Dt:
06/22/2008
Assignee:
P. O. BOX 5052
M/C: 483-400-402
TROY, MICHIGAN 48007-5052
Correspondent:
DELPHI TECHNOLOGIES, INC.
P. O. BOX 5052
M/C: 483-400-402
TROY, MI 48007-5052
Assignment: 2
Reel/Frame:
045127/0546Recorded: 01/23/2018Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/29/2017
Assignee:
ERIN COURT, BISHOP'S COURT HILL
ST. MICHAEL, BARBADOS
Correspondent:
DELPHI TECHNOLOGIES IP LIMITED
5825 INNOVATION DRIVE
LEGAL STAFF - M/C 480-415-154
TROY, MI 48098
Assignment: 3
Reel/Frame:
068985/0968Recorded: 09/18/2024Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/01/2024
Assignee:
C/O CORPORATION TRUST CENTER
1209 ORANGE STREET
WILMINGTON, DELAWARE 19801
Correspondent:
JAMESON MA
2000 PENNSYLVANIA AVENUE, NW
SUITE 4001
WASHINGTON, DC 20646

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