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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
06/01/2010
Application #:
12113881
Filing Dt:
05/01/2008
Publication #:
Pub Dt:
11/05/2009
Inventors:
Kangping Zhang, Fong-Long Lin
Title:
METHOD OF TESTING AN INTEGRATED CIRCUIT DIE, AND AN INTEGRATED CIRCUIT DIE
Assignment: 1
Reel/Frame:
020889/0145Recorded: 05/01/2008Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/23/2008
Exec Dt:
04/26/2008
Assignee:
1171 SONORA COURT
SUNNYVALE, CALIFORNIA 94086
Correspondent:
DLA PIPER US LLP
2000 UNIVERSITY AVENUE
E. PALO ALTO, CA 94303-2248
Assignment: 2
Reel/Frame:
024776/0624Recorded: 08/03/2010Pages: 13
Conveyance:
NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/21/2010
Assignee:
2000 UNIVERSITY AVENUE
EAST PALO ALTO, CALIFORNIA 94303
Correspondent:
RONALD L. YIN
DLA PIPER LLP US
2000 UNIVERSITY AVENUE
EAST PALO ALTO, CA 94303
Assignment: 3
Reel/Frame:
024776/0637Recorded: 08/03/2010Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/09/2010
Assignee:
3970 FREEDOM CIRCLE
SUITE 100
SANTA CLARA, CALIFORNIA 95054
Correspondent:
RONALD L. YIN
DLA PIPER LLP US
2000 UNIVERSITY AVENUE
EAST PALO ALTO, CA 94303

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