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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/08/2010
Application #:
10598717
Filing Dt:
09/08/2006
Publication #:
Pub Dt:
08/16/2007
Inventors:
Tetsuo Shimomura, Masahiko Nakamori, Takatoshi Yamada, Kazuyuki Ogawa et al
Title:
POLISHING PAD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
018240/0846Recorded: 09/08/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2006
Exec Dt:
08/30/2006
Exec Dt:
08/30/2006
Exec Dt:
08/30/2006
Exec Dt:
08/30/2005
Exec Dt:
08/30/2006
Assignee:
17-18, EDOBORI 1-CHOME
NISHI-KU
OSAKA-SHI, OSAKA, JAPAN 550-8661
Correspondent:
KNOBBE, MARTENS, OLSON & BEAR, LLP
2040 MAIN STREET
14TH FLOOR
IRVINE, CA 92614
Assignment: 2
Reel/Frame:
037996/0954Recorded: 03/16/2016Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/25/2015
Assignee:
451 BELLEVUE ROAD
NEWARK, DELAWARE 19713
Correspondent:
KATHY WERTZ
2040 DOW CENTER
MIDLAND, MI 48674

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