Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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12279519
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Filing Dt:
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12/05/2008
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Publication #:
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Pub Dt:
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04/09/2009
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Inventors:
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Joon-Mo Seo, Byoung-Un Kang, Kyung-Tae Wi, Jae-Hoon Kim, Tae-Hyun Sung, Soon-Young Hyun et al
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Title:
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DICING DIE ATTACHMENT FILM AND METHOD FOR PACKAGING SEMICONDUCTOR USING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 19-20F ASEM TOWER 159 |
| SAMSUNG-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-090 |
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| STROOCK & STROOCK & LAVAN LLP |
| 180 MAIDEN LANE |
| NEW YORK, NY 10038 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20 YEOUIDO-DONG,YEONGDEUNGPO-GU |
| SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 150-721 |
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| STROOCK & STROOCK & LAVAN LLP |
| 180 MAIDEN LANE |
| NEW YORK, NY 10038 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 62-7, TECHNO 1-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-509 |
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| RENAISSANCE IP LAW GROUP LLP (PORTLAND I |
| 9600 SW OAK ST. SUITE 560 |
| PORTLAND, OR 97223 |
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