Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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11849746
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Filing Dt:
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09/04/2007
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Publication #:
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Pub Dt:
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01/01/2009
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Inventors:
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Shaw-Fuu Wang, Ting-Chiang Huang, Shih-Chen Shen, Sheng-Jie Syu
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Title:
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HEAT DISSIPATION MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 66, HOU-KANG ST., SHIH-LIN DISTRICT |
| TAIPEI CITY, TAIWAN R.O.C. |
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| J. C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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