Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/31/2010
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Application #:
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11481012
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Filing Dt:
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07/06/2006
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Publication #:
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Pub Dt:
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01/18/2007
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Inventors:
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Min-seog Choi, Kae-dong Back, In-sang Song, Woon-bae Kim, Byung-gil Jeong, Kyu-dong Jung
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Title:
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PACKAGING CHIP HAVING INTERCONNECTION ELECTRODES DIRECTLY CONNECTED TO PLURAL WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, |
| YEONGTONG-GU, SUWON-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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