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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/07/2010
Application #:
10580361
Filing Dt:
04/18/2007
Publication #:
Pub Dt:
02/14/2008
Inventors:
Roy Knechtel, Andrej Lenz
Title:
PRODUCTION OF SEMICONDUCTOR SUBSTRATES WITH BURIED LAYERS BY JOINING (BONDING) SEMICONDUCTOR WAFERS
Assignment: 1
Reel/Frame:
021255/0429Recorded: 07/17/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/16/2006
Exec Dt:
06/12/2006
Assignee:
HAARBERGSTRASSE 67
99097 ERFURT, GERMANY
Correspondent:
RICHARD C. STEVENS
STEVENS & SHOWALTER LLP
7019 CORPORATE WAY
DAYTON, OH 45459-4238

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