Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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11915914
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Filing Dt:
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11/29/2007
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Publication #:
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Pub Dt:
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12/10/2009
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Inventors:
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Tsuyoshi Tanaka, Masaharu Yamamoto
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Title:
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HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND METHOD FOR PRODUCING HERMETIC SEALING CAP
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-19-1, MINAMI-SUITA, SUITA-SHI, |
OSAKA, JAPAN 564-0043 |
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WESTERMAN, HATTORI, DANIELS & ADRIAN LLP |
1250 CONNECTICUT AVENUE NW, |
SUITE 700 |
WASHINGTON,, DC 20036 |
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