Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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12228683
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Filing Dt:
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08/15/2008
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Publication #:
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Pub Dt:
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04/23/2009
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Inventors:
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Jen-Chuan Chen, Chi-Chih Shen, Hui-Shan Chang, Tommy Pan
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Title:
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FLIP CHIP PACKAGE STRUCTURE AND CARRIER THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26, CHIN 3RD., 811, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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J. C. PATENTS |
4 VENTURES, SUITE 250 |
IRVINE, CA 92618 |
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