Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/19/2010
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Application #:
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12216397
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Filing Dt:
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07/03/2008
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Publication #:
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Pub Dt:
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01/07/2010
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Inventor:
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Ming-Che Wu
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Title:
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EMBEDDED PACKAGE STRUCTURE MODULE WITH HIGH-DENSITY ELECTRICAL CONNECTIONS AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 141, LANE 351, SEC.1, TAIPING RD. |
| TSAO TUEN |
| NAN-TOU, TAIWAN R.O.C. |
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| ROSENBERG, KLEIN & LEE |
| MORTON J. ROSENBERG, ESQ. |
| 3458 ELLICOTT CENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1558, ZHANG DONG ROAD, ZHANGJIANG HI-TECH PARK |
| SHANGHAI, CHINA 201203 |
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| 141, LANE 351, SEC. 1, TAIPING ROAD, TSAOTUEN, |
| NANTOU, TAIWAN 54261 |
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| HDLS IPR SERVICES |
| P.O. BOX. 220746 |
| CHANTILLY, VA 20153 |
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