Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/19/2010
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Application #:
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11826516
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Filing Dt:
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07/16/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Inventors:
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Geng-Shin Shen, Wu-Chang Tu
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Title:
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STACKED CHIP PACKAGE STRUCTURE WITH LEADFRAME HAVING INNER LEADS WITH TRANSFER PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, R&D RD. 1 |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN ROC |
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CANON'S COURT 22 VICTORIA STREET |
HAMILTON HM 12, BERMUDA |
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STANLEY P. FISHER |
REED SMITH LLP |
3110 FAIRVIEW PARK DR. |
SUITE 1400 |
FALLS CHURCH, VA 22042 |
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