Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/02/2010
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Application #:
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12277829
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Filing Dt:
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11/25/2008
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Publication #:
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Pub Dt:
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05/27/2010
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Inventors:
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Chuan-Yi Lin, Song-Bor Lee, Ching-Kun Huang, Sheng-Yuan Lin
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Title:
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METHOD OF FORMING THROUGH-SILICON VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L..L..P. |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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