Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/2010
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Application #:
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12428277
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Filing Dt:
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04/22/2009
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Publication #:
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Pub Dt:
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11/12/2009
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Inventors:
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Yao-Kai Chuang, Chien Liu, Chih-Ming Chung, Chao-Cheng Liu
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Title:
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STACKED TYPE CHIP PACKAGE STRUCTURE INCLUDING A CHIP PACKAGE AND A CHIP THAT ARE STACKED ON A LEAD FRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26, CHIN 3RD, RD., 811, NANTZE |
EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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J. C. PATENTS |
4, VENTURE SUITE 250 |
IRVINE, CA 92618 |
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