Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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12158726
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Filing Dt:
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06/23/2008
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Publication #:
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Pub Dt:
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02/05/2009
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Inventors:
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Young-Se Kwon, Kyoung Min Kim
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Title:
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THREE-DIMENSIONAL PACKAGE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2305, SEMICONDUCTOR-DONG, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
| GUSEONG-DONG, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
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| SHERIDAN ROSS P.C. |
| 1560 BROADWAY |
| SUITE 1200 |
| DENVER, CO 80202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| (GOMAE-DONG) 12, WONGOMAE-RO |
| GIHEUNG-GU, YONGIN-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF 135-010 |
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| SHERIDAN ROSS P.C. |
| 1560 BROADWAY |
| SUITE 1200 |
| DENVER, CO 80202 |
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