Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12848652
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Filing Dt:
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08/02/2010
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Publication #:
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Pub Dt:
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11/25/2010
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Inventor:
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Koji Munakata
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3701 E. UNIVERSITY DRIVE |
| PHOENIX, ARIZONA 85034 |
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| JOHN R. WAHL |
| GREENBERG TRAURIG LLP |
| 1200 17TH STREET, SUITE 2400 |
| DENVER, CO 80202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE |
| KUNSHAN, JIANGSU, CHINA 215300 |
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| GANG YU |
| ACIP INTERNATIONAL, INC. 419 10TH ST, |
| SF, CA 94103 |
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