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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
7863758
Issue Dt:
01/04/2011
Application #:
12000070
Filing Dt:
12/07/2007
Publication #:
20080145668
Pub Dt:
06/19/2008
Inventors:
Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Jeong, Kyoung Jin Ha et al
Title:
ADHESIVE FILM COMPOSITION, ASSOCIATED DICING DIE BONDING FILM, AND DIE PACKAGE
Assignment: 1
Reel/Frame:
020267/0201Recorded: 12/07/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JUNG, KI SUNG
Exec Dt:
12/03/2007
KIM, WAN JUNG
Exec Dt:
11/29/2007
HONG, YONG WOO
Exec Dt:
11/29/2007
CHUNG, CHANG BUM
Exec Dt:
11/30/2007
JEONG, CHUL
Exec Dt:
11/30/2007
PYUN, AH RAM
Exec Dt:
11/28/2007
IM, SU MI
Exec Dt:
11/29/2007
HA, KYOUNG JUN
Exec Dt:
12/03/2007
Assignee:
CHEIL INDUSTRIES, INC.
290, GONGDAN 2-DONG, GUMI-SI
GYEONGSANGBUK-DO, KOREA, REPUBLIC OF
Correspondent:
EUGENE M. LEE
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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