Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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11475131
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Filing Dt:
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06/27/2006
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Publication #:
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Pub Dt:
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12/27/2007
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Inventors:
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Ming-Chih Yew, Chang-Ann Yuan, Chan-Yen Chou, Kou-Ning Chiang
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Title:
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3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP |
| HSINCHU CITY 303, TAIWAN R.O.C. |
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| BACON & THOMAS, PLLC |
| 625 SLATERS LANE |
| FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 5F, NO. 65, GUANGFU N. RD., ZHONGXING VIL. |
| HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 303 |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 125 S ROYAL ST. |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 4F, NO. 38, SHENGLI 2ND RD. |
| ZHUBEI CITY, HSINCHU COUNTY, TAIWAN |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 125 S ROYAL STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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