Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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11850283
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Filing Dt:
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09/05/2007
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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Hsien-Wei Chen, Shih-Hsun Hsu
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Title:
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METHOD AND STRUCTURE FOR INCREASED WIRE BOND DENSITY IN PACKAGES FOR SEMICONDUCTOR CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| STEVEN E. KOFFS, DUANE MORRIS LLP |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103-4196 |
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