Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/22/2011
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Application #:
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12165628
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Filing Dt:
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06/30/2008
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Publication #:
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Pub Dt:
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11/26/2009
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Inventors:
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Jiin-Jyh Shyu, Chih-Hsien Yeh
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Title:
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LEAD-FREE SEALING MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 22, CHUNGSHAN N. RD., 3RD SEC., |
| TAIPEI, TAIWAN 104 |
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| NO. 40, CHUNGSHAN N. RD., 3RD SEC., |
| TAIPEI, TAIWAN 104 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY |
| 7F-1,NO.100,ROOSEVELT RD.,SEC.2, |
| TAIPEI, 100 TAIWAN |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 37, KEJI 2ND RD., HUA YA TECHNOLOGY PARK |
| GUEISHAN TOWNSHIP, TAOYUAN, TAIWAN 333 |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO RD., STE 310 |
| FAIRFAX, VA 22033 |
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