Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/01/2011
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Application #:
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11979931
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Filing Dt:
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11/09/2007
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Publication #:
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Pub Dt:
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08/07/2008
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Inventors:
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Masayuki Yamamoto, Yasuji Kaneshima
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Title:
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APPARATUS FOR CUTTING THE PROTECTIVE TAPE OF SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
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| LEE CHENG |
| 1100 17TH STREET, N.W., SUITE 503 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 10300 SPOTSYLVANIA AVENUE |
| SUITE 420 |
| FREDERICKSBURG, VIRGINIA 22408 |
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| MARTENSEN IP |
| 30 EAST KIOWA STREET SUITE 101 |
| COLORADO SPRINGS, CO 80903 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5450 TECH CDENTER DRIVE SUITE 400 |
| COLORADO SPRINGS, COLORADO 80919 |
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| MARTENSEN IP |
| 30 EAST KIOWA STREET SUITE 101 |
| COLORADO SPRINGS, CO 80903 |
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