Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/22/2011
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Application #:
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12153705
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Filing Dt:
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05/22/2008
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Publication #:
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Pub Dt:
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11/27/2008
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Inventors:
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Ju Pyo Hong, Seog Moon Choi, Seung Wook Park, Tae Hoon Kim, Job Ha
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Title:
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WAFER LEVEL DEVICE PACKAGE WITH SEALING LINE HAVING ELECTROCONDUCTIVE PATTERN AND METHOD OF PACKAGING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN 3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF |
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| STAAS & HALSEY LLP |
| ATTENTION: JOHN C. GARVEY |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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