Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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12143540
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Filing Dt:
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06/20/2008
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Publication #:
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Pub Dt:
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12/24/2009
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Inventors:
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Arvind K. Sinha, Thomas S. Thompson
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Title:
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METHOD AND APPARATUS OF CHANGING PCB PAD STRUCTURE TO INCREASE SOLDER VOLUME AND STRENGTH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION (SWP) |
| C/O SUITER SWANTZ PC LLO |
| 14301 FNB PARKWAY, SUITE 220 |
| OMAHA, NE 68154-5299 |
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