Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2011
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Application #:
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12463830
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Filing Dt:
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05/11/2009
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Publication #:
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Pub Dt:
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11/12/2009
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Inventors:
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Thomas Dyer BONIFIELD, Thomas W. WINTER, William R. MORRISON, Gregory D. WINTERTON et al
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Title:
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DOUBLE WAFER CARRIER PROCESS FOR CREATING INTEGRATED CIRCUIT DIE WITH THROUGH-SILICON VIAS AND MICRO-ELECTRO-MECHANICAL SYSTEMS PROTECTED BY A HERMETIC CAVITY CREATED AT THE WAFER LEVEL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7839 CHURCHILL WAY |
| M/S 3999 |
| DALLAS, TEXAS 75251 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474, M/S 3999 |
| DALLAS, TX 75265 |
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