Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2011
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Application #:
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12003884
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Filing Dt:
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01/03/2008
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Publication #:
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Pub Dt:
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07/10/2008
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Inventors:
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Byoung Hwa Lee, Sung Kwon Wi, Hae Suk Chung, Sang Soo Park, Min Cheol Park et al
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Title:
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MULTILAYER CHIP CAPACITOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314, MAETAN3-DONG, YEONGTONG-GU, SUWON |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, D.C. 20005-3096 |
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