Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/21/2011
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Application #:
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12075023
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Filing Dt:
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03/06/2008
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Inventors:
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Thomas Ponnuswamy, John Sukamto, Jonathan Reid, Steve Mayer
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Title:
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TWO STEP COPPER ELECTROPLATING PROCESS WITH ANNEAL FOR UNIFORM ACROSS WAFER DEPOSITION AND VOID FREE FILLING ON RUTHENIUM COATED WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3970 NORTH FIRST STREET |
SAN JOSE, CALIFORNIA 95134 |
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BEYER WEAVER LLP |
P.O. BOX 70250 |
OAKLAND, CA 94612-0250 |
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