Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/05/2011
|
Application #:
|
11457400
|
Filing Dt:
|
07/13/2006
|
|
Inventors:
|
Kenneth H. Church, Patrick Clark, Dongjiang Xu, Lance Swan, Bryan Irwin et al
|
|
Title:
|
METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC CHIPS BY MICRODISPENSED INTERCONNECTIONS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2100 NORTH ALAFAYA TRAIL, STE. 200 |
| ORLANDO, FLORIDA 32826 |
|
|
|
|
| MARY M. LEE |
| 1300 E. 9TH STREET, NO. 4 |
| EDMOND, OK 73034-5760 |
|
|
Search Results as of:
06/06/2024 12:34 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
