Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/05/2011
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Application #:
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12483528
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Filing Dt:
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06/12/2009
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Publication #:
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Pub Dt:
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12/17/2009
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Inventors:
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Shin-Ping Hsu, Kan-Jung Chia
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Title:
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PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LI-HSIN ROAD, |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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EDWARDS ANGELL PALMER & DODGE LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE |
TAOYUAN, TAIWAN |
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EDWARDS ANGELL PALMER & DODGE LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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