Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/19/2011
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Application #:
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11921008
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Filing Dt:
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11/26/2007
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Publication #:
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Pub Dt:
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09/17/2009
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Inventors:
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Takehiko Ueda, Hosei Nakahira, Akira Ishikawa
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Title:
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METHOD FOR DETECTING POLISHING END IN CMP POLISHING DEVICE, CMP POLISHING DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8331 |
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| MICHAEL R. KELLY |
| FINNEGAN, HENDERSON, FARABOW, ET AL |
| 901 NEW YORK AVENUE, N.W. |
| WASHINGTON, DC 20001-4413 |
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