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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/02/2011
Application #:
12921511
Filing Dt:
09/08/2010
Publication #:
Pub Dt:
01/06/2011
Inventor:
Yuuichirou Noda
Title:
RESIN MOLDING PROCESS AND RESIN-MOLDING MOLD DEVICE
Assignment: 1
Reel/Frame:
024960/0955Recorded: 09/09/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/24/2010
Assignee:
3700, AZA WADAYAMA, SHIMONAKA
SADOWARA-CHO, MIYAZAKI-SHI
MIYAZAKI, JAPAN
Correspondent:
ARENT FOX LLP
1050 CONNECTICUT AVENUE, N.W.
SUITE 400
WASHINGTON, DC 20036-5339

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