Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/02/2011
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Application #:
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12549033
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Filing Dt:
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08/27/2009
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Publication #:
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Pub Dt:
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03/04/2010
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Inventors:
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HYUN-IK HWANG, YONG-JIN JUNG, KUNHO SONG
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Title:
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SEMICONDUCTOR PACKAGE WHICH INCLUDES AN INSULATING LAYER LOCATED BETWEEN PACKAGE SUBSTRATES WHICH MAY PREVENT AN ELECTRICAL SHORT CAUSED BY A BONDING WIRE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416, MAETAN-DONG |
YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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FRANK CHAU |
130 WOODBURY ROAD |
WOODBURY, NY 11797 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF AN ASSIGNOR PREVIOUSLY RECORDED ON REEL 023158 FRAME 0303. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT THE NAME OF ASSIGNOR YONGJIN JANG TO YONGJIN JUNG.
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416, MAETAN-DONG, YEONGTONG-GU, |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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F. CHAU & ASSOCIATES, LLC |
130 WOODBURY ROAD |
WOODBURY, NY 11797 |
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