Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/23/2011
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Application #:
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12656073
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Filing Dt:
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01/15/2010
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Publication #:
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Pub Dt:
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03/10/2011
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Inventors:
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Chang-Hwang Hua, Wen Chu
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Title:
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METHOD OF USING AN ELECTROLESS PLATING FOR DEPOSITING A METAL SEED LAYER FOR THE SUBSEQUENT PLATED BACKSIDE METAL FILM
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK |
TAO YUAN SHEIN, TAIWAN R.O.C. |
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BACON & THOMAS, PLLC |
625 SLATERS LANE |
FOURTH FLOOR |
ALEXANDRIA, VA 22314-1176 |
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