Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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12398174
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Filing Dt:
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03/04/2009
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Publication #:
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Pub Dt:
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09/10/2009
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Inventors:
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Chih-Chia Tsai, Cheng-Yi Chang, Ming-Kuei Lin
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Title:
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LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 25, LANE 76, SEC. 3, CHUNG YANG RD. |
TU CHEN CITY, TAIPEI HSIEN, TAIWAN |
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C. DAVID PAI |
1001 FOURTH AVENUE, SUITE 3200 |
SEATTLE, WA 98154 |
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