Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/06/2011
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Application #:
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12287466
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Filing Dt:
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10/09/2008
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Publication #:
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Pub Dt:
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04/15/2010
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Inventors:
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Wang Zhe, Chong Ser Choong
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Title:
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FOLDED LEAD-FRAME PACKAGES FOR MEMS DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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198 PANDAN LOOP #06-09 |
PANTECH INDUSTRIAL COMPLEX |
SINGAPORE, SINGAPORE 128384 |
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SAILE ACKERMAN LLC |
28 DAVIS AVENUE |
POUGHKEEPSIE, NY 12603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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69TH LONGQUAN ST |
FANGZI DEVELOPMENT ZONE, SHANDONG 261200 P.R.O.C. |
PEOPLE'S REPUBLIC OF CHINA, CHINA |
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SAILE ACKERMAN LLC |
28 DAVIS AVENUE |
POUGHKEEPSIE, NY 12603 |
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