Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/13/2011
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Application #:
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11933990
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Filing Dt:
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11/01/2007
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Publication #:
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Pub Dt:
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05/07/2009
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Inventors:
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You Chye HOW, Shee Min YEONG
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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BEYER WEAVER LLP |
P.O. BOX 70250 |
OAKLAND,, CA 94612-0250 |
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