Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/20/2011
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Application #:
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11399856
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Filing Dt:
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04/07/2006
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Publication #:
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Pub Dt:
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02/08/2007
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Inventors:
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Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi et al
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Title:
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SOLDER COMPOSITION FOR ELECTRONIC DEVICES
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Assignment:
1
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MERGER AND CHANGE OF NAME
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1753, SHIMONUMABE, NAKAHARA-KU |
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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ROGER HYLTON |
TWO EMBARCADERO CENTER, 8TH FLOOR |
KILPATRICK TOWNSEND & STOCKTON LLP |
SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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2-24, TOYOSU 3-CHOME, KOUTOU-KU |
TOKYO, JAPAN |
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MATTINGLY & MALUR, PC |
1800 DIAGONAL ROAD |
SUITE 210 |
ALEXANDRIA, VA 22314 |
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