Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12630204
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Filing Dt:
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12/03/2009
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Publication #:
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Pub Dt:
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04/01/2010
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Inventors:
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Jung-Fang Chang, Te-Chi Wong, Yu-Hung Chen, Chien-Te Hsieh, Chin-Jen Huang
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Title:
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STRUCTURE OF THERMAL RESISTIVE LAYER AND THE METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG-HSING ROAD, CHU-TUNG |
| HSIN-CHU, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 1940 DUKE STREET SUITE 200 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26F., NO. 1, SONGZHI RD., XINYI DIST., |
| TAIPEI CITY, TAIWAN 11047 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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