Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/11/2011
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Application #:
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12547575
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Filing Dt:
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08/26/2009
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Publication #:
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Pub Dt:
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09/30/2010
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Inventors:
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Edward-yi Chang, Li-Han Hsu, Wei-Cheng Wu, Chin-te Wang, Chee-Way Oh
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Title:
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HIGH FREQUENCY FLIP CHIP PACKAGE PROCESS OF POLYMER SUBSTRATE AND STRUCTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1001, UNIVERSITY ROAD |
| HSINCHU, TAIWAN 300 |
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| HUNG-CHIH TSENG |
| 13611 NORTHBOURNE DR. |
| CENTREVILLE, VA 20120 |
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