Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2012
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Application #:
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12845852
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Filing Dt:
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07/29/2010
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Publication #:
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Pub Dt:
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02/03/2011
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Inventors:
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Hsiang-Huan Lee, Ming Han Lee, Ming-Shih Yeh, Chen-Hua Yu, Shau-Lin Shue
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Title:
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LOW RESISTANCE HIGH RELIABILITY CONTACT VIA AND METAL LINE STRUCTURE FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| DUANE MORRIS LLP |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103-4196 |
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