Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2012
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Application #:
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12501246
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Filing Dt:
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07/10/2009
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Publication #:
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Pub Dt:
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01/14/2010
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Inventors:
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Hsiao Chuan CHANG, Tsung Yueh Tsai, Yi Shao Lai, Ho Ming Tong, Wei Chi Yih et al
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Title:
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WAFER AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| LOWE HAUPTMAN HAM & BERNER, LLP |
| 1700 DIAGONAL ROAD |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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