Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/06/2012
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Application #:
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12312981
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Filing Dt:
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06/03/2009
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Publication #:
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Pub Dt:
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01/28/2010
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Inventors:
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Satoru Kudose, Tomokatsu Nakagawa, Tatsuya Katoh
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Title:
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IC CHIP PACKAGE EMPLOYING SUBSTRATE WITH A DEVICE HOLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22-22 NAGAIKE-CHO ABENO-KU |
| OSAKA-SHI, OSAKA, JAPAN 545-8522 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1437 HANGDU BUILDING,NO. 1006,HUAFU ROAD, HUAHANG COMMUNITY,HUAQIANGBEI STREET, FUTIAN DISTRICT |
| SHENZHEN, CHINA |
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| CALVIN H CHAI |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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